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Thin wall mold release problems: demands
in mold design, cosmetic value requirements and the type of material used
in fabrication. Strangely, other types of mold release problems are usually
caused substances and techniques that are supposed to solve such problems. With The Aid Of Nanotechnology The modern day approach in solving mold release problems is with the incorporation of nanotechnology. With such advancements, it is now possible to scrutinize matter and processes in greater detail. This makes it easier to accurately investigate and identify the root causes of mold release problems. Surface Topography Surface topography and surface chemistry are the main root causes of mold release problems. The physical roughness of mold cavities promote friction as well as provide ideal areas where resin can attach itself to. Chemical Reactivity Chemical reactivity of mold cavity surfaces invite the onset of corrosion and abrasion. As long as mold cavity surfaces come into contact with other chemically reactive substances, corrosion will set it. And as the process of corrosion accelerates, pitting and crevices on the mold cavity surfaces will get larger and larger untill the mold cavity surface is rough enough to participate in another process: friction. Friction and abrasion accelerate each other. Abrasion makes the surface even rougher and this produces a higher coefficient of friction. Root Causes Of Mold Release Problems Are Identified Mold release problems: as can be seen, physical roughness and chemical reactivity of mold cavity surfaces are inter-related. They are the root causes of mold release sticking, resin build ups that cause parts to get stuck in the mold and poor cosmetic finishings of fabricated parts. Other Causes of Thin Wall Mold Release Problems When mold release agents are applied onto mold cavity surfaces, short molding can occur. This type of problems is where parts with missing profiles and fish-eye irregularities become visible on fabricated parts. Mold release agents can also create a luting effect that causes parts to get stuck in the mold. This form of vacuum bonding occurs when air cannot flow onto vital areas of the mold cavity surface, making mold release impossible. Cross-contamination and transmigration of contaminants also result from the use of mold release agents such as mold wash, mold wax, mold sprays and other such parting agents. Nanotechnological Solution Nanomouldrelease is the product of advancements in nanotechnology. It gets to the root of the problem and fixes it. Unlike mold release agents that must be applied over and over again, an application of Nanomouldrelease has been known to last for more 100,000 cycles and does not transmigrate to fabricated parts. Find out about how Nanomouldrelease can solve your mold release problems today. |
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keywords:thin wall mold release problems |
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